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Customer Engineer

  • DISCO Hi-Tec America
  • Hillsboro, OR, 97124
  • Full Time
  • Any level
  • Entry Level
View All Jobs at DISCO Hi-Tec America

Posted on

Job Description:

General Job Description:

  • Installation services and troubleshooting/repair of wafer grinding, dicing, and laser equipment
  • Train customer’s personnel in the service, maintenance, and operation of equipment.
  • Provide telephone and email support for customers with problems/questions.
  • Extensive travel may be required to perform job duties and/or training.

Education:

  • AS from accredited technical school or equivalent military school
  • BSEE or BSME degree is a plus.

Experience:

  • 3 years of related Field Service or mechanical repair experience. Expertise in wafer fabrication, electro-pneumatic controls, microprocessor-based controls, and the basic concepts of robotics software preferred.

Skills & Qualifications:

  • Troubleshooting, repair of electromechanical equipment
  • Strong mechanical aptitude
  • Knowledge of operation of various hand tools, multimeters, and oscilloscopes
  • Reading and interpreting drawings and schematics
  • Verbal and Written Communication
  • Bilingual (Spanish or Japanese) a plus
  • Positive attitude, reliable and high motivational level
  • Problem solving and decision making
  • Strong MS Office and other related computer skills
  • Works well under pressure
  • Excellent team player

Salary and benefits are competitive and commensurate with experience. To learn more about our company and our products, visit our website at www.disco.co.jp.


COVID-19 precautions
  • Remote interview process
  • Personal protective equipment provided or required
  • Temperature screenings
  • Social distancing guidelines in place
  • Virtual meetings
  • Sanitizing, disinfecting, or cleaning procedures in place

We also have strict quarantining rules based on travel, and we include a UV station for the bottom of shoes to be used prior to entering the building.


Company Description:

DISCO Corporation, with operations in North America, Europe and Asia, is a multi-billion dollar global leader in the design and manufacture of wafer dicing and grinding equipment.

For over 80 years, we have been pioneering solutions for our customers and pushing the limits of technology. We seek outstanding candidates who demonstrate a passion for excellence and who can thrive in a high-growth, fast-paced industry.

DISCO is an international company headquartered in Tokyo, Japan.

www.disco.co.jp
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